Constant temperature and humidity test chamber is a kind of equipment widely used in many industries, which can simulate the temperature and humidity changes under different environmental conditions, and test the physical properties of the materials of TFT LCD display screen. This equipment is especially critical in the fields of defense, aerospace, and military industry, as well as in the testing of BGAs, PCB substrate wrenches, electronic chip ICs, semiconductors, ceramics, magnetic materials, and polymer materials. It assesses the resistance of materials to extreme temperature conditions and the chemical or physical damage that may occur to products under temperature changes, thus ensuring product quality.
The ability of constant temperature and humidity test chambers to test electronic components includes: performance testing, troubleshooting, durability assessment, stress screening, and environmental adaptation. These chambers are indispensable tools for ensuring product testing in a variety of fields, from precision integrated circuits to heavy-duty mechanical components, and help manufacturers improve product quality and meet the performance requirements of the entire machine. Jinjian Laboratory launched the \”double 85 temperature and humidity environment test\” business, to help customers understand the heat and humidity resistance of the product, to provide products through the double 85 test analysis and improvement of the program, for the enterprise\’s product research and development and quality control to provide important support to help enhance product competitiveness and user satisfaction.
1, high temperature storage
Most of the failure of electronic components is caused by a variety of physical and chemical changes in the body and surface, these changes are closely related to temperature. After the temperature rises, the chemical reaction speed is greatly accelerated, accelerating the failure process. So that defective components can be exposed and eliminated in time.
High temperature screening is widely used in semiconductor devices to effectively eliminate failure mechanisms such as surface contamination, poor bonding and oxide layer defects. It is generally stored at the highest junction temperature for 24~168 hours. High-temperature screening is simple, easy, inexpensive, and can be performed on many components. After high temperature storage, it can stabilize the parameter performance of components and reduce the parameter drift in use.
2、Electricity test
In the screening process, the role of integrated thermoelectric stress can effectively reveal the potential defects of the electronic components themselves and their surfaces, which is a key step to ensure the reliability of the components. Screening of electronic components is usually carried out under rated power conditions, with durations ranging from a few hours to as long as 168 hours.
For some products, especially integrated circuits, changing the test conditions requires caution to avoid compromising their performance. In these cases, high stress test conditions can be achieved by increasing the junction temperature by raising the operating temperature. Power refining tests require the use of specialized high and low temperature test chambers, which are costly and the screening time should not be too long to avoid unnecessary waste of resources.
In the field of civil products, the screening time is usually a few hours to ensure the basic reliability of the product. For military use or products requiring higher reliability, the screening time may be extended to 100 to 168 hours. For aerospace-grade components, the screening cycle may be even longer, at 240 hours or more, to meet performance requirements under extreme conditions. This meticulous screening process ensures the stability and reliability of electronic components in a variety of application environments, thereby improving the overall quality and performance of the final product.
3、Temperature cycling
Electronic products in the actual application will face a variety of environmental temperature challenges. Due to the physical phenomenon of thermal expansion and contraction, those components with insufficient thermal matching performance are prone to failure under temperature changes. Temperature cycling testing is a screening method that utilizes the stress generated by temperature changes between extreme high and extreme low temperatures to identify and exclude those components that may have thermal performance issues. This type of testing typically consists of 5 to 10 cycles at temperatures ranging from -55°C to 125°C.
Power refinement testing requires the use of specialized test equipment, which tends to be costly, so the duration of the screening process needs to be reasonably controlled. For civilian electronics, the screening time is usually short, only a few hours, to ensure cost-effectiveness. For military applications or products that require higher reliability, the screening time may be extended to 100 to 168 hours. As for aerospace-grade components, the screening cycle may be even longer, at 240 hours or more, due to their extremely high reliability requirements.
Through this rigorous screening process, you can significantly improve the stability and durability of electronic products in the face of extreme temperature conditions, thus ensuring their reliability in a variety of environmental applications.
4, the need to screen components
The inherent reliability of electronic components depends on the reliability design of the product. In the product manufacturing process, due to human factors or fluctuations in raw materials, process conditions, equipment conditions, the final product does not all achieve the expected inherent reliability. In each batch of finished products, there are always some products have some potential defects and weaknesses.
